ASML mentioned final week that it plans to ship 30 ultra-violet ultraviolet scanners in 2019, considerably from 2018. The plan isn’t a surprise as demand for EUV lithography instruments will increase and semiconductor producers construct new factories. As well as, ASML introduced plans to introduce a brand new EUV scanner providing greater manufacturing throughput, the NXE: 3400C.
Final 12 months, ASML delivered (solely) 18 Twinscan NXE: 3400B EUV scanners. This was barely under expectations for the supply of 20 machines. In complete, 31 EUV scanners have been put in in July 2018 at numerous crops around the globe, together with a number of machines in numerous semiconductor analysis organizations, together with imec. If every thing goes as deliberate, ASML 2019 will ship extra ultraviolet scanners than in earlier years.
Samsung Foundry has already begun deploying ASML's EUV tools for the manufacturing of economic chips utilizing its 7LPP course of expertise at its Fab S3. As reported a major enhance in EUV lithography via Samsung will begin after Hwaseong constructed one other manufacturing line designed for EUV instruments from the outset. The plant is ready to $ 6 trillion ($ four,615 billion) in and is predicted to be accomplished later this 12 months and to start mass manufacturing by 2020.
TSMC will use its Twinscan NXE industrial wafer scanners within the second half of this 12 months to make chips utilizing its N7 + expertise. Initially EUV scanners have been used for non-critical layers, however their use is prolonged on the 5nm node within the interval 2020-2021. TSMC states that just about all prospects utilizing the N7 manufacturing course of can even use N5 expertise for next-generation chips.
Demand for ASML's Twinscan NXE instruments continues to develop with demand from Intel and SK Hynix. Intel will want EUV instruments because it expands its manufacturing services in Oregon, Israel and Eire. As well as, the chip maker wants EUV scanners to equip its Fab 42 in Arizona. These factories are used to make chips utilizing Intel's manufacturing course of 7 nm . SK Hynix will want EUV instruments for its new manufacturing unit close to Icheon, South Korea.
Based on ASML, an EUV layer requires an EUV step-and-scan system for each ~ 45,000 wafer begins monthly. As main semiconductor producers broaden their use of EUV instruments sooner or later, they may want further scanners, which in fact will increase the demand for ASML Twinscan NXE merchandise.
Later this 12 months, ASML will introduce its new Twinscan NXE: 3400C EUV scanner able to dealing with 170 wafers per hour versus 155 wafers per hour on the NXE: 3400B. The brand new scanner makes use of Cymer's new 340W gentle supply for greater efficiency. With ASML's Twinscan NXE: 3400C, chip makers can hold cycle occasions at bay for his or her next-generation chips.
"We delivered six programs within the fourth quarter, resulting in a complete of 18 EUV shipments in 2018," mentioned Peter Wennink, CEO of ASML, in a convention name final week. "With the 5 orders booked this quarter, our delivery plan is roofed by 30 programs for 2019. With DUV, we delivered 189 new programs in 2018, a 17% enhance over 2017, and we continued to extend our efficiency to assist demand from each logic and storage prospects. And we’ve additional developed our latest NXT: 2000 dive system with file time to realize mature buyer returns. "